1,3-Diethylimidazolium hexafluorophosphate, CAS: 370085-15-7

Key Applications:

• Electrochemical & Energy Storage Applications

• • Electrolyte component in lithium, sodium, and magnesium battery research due to its wide electrochemical window and moisture‑resistant PF₆⁻ anion.
  • Ionic liquid additive to improve ionic conductivity and thermal stability in polymer electrolytes.
  • Electrochemical double‑layer capacitor (EDLC) studies, especially where low vapor pressure and high dielectric strength are required.
• Catalysis & Organic Synthesis

• • Reaction medium for transition‑metal catalysis, including C–C and C–N coupling, benefiting from its tunable polarity and thermal robustness.
  • Phase‑transfer catalyst environment, particularly in biphasic systems where hydrophobic ionic liquids enhance reaction rates and selectivity.
  • Green chemistry solvent alternative to volatile organic solvents in high‑temperature or moisture‑sensitive transformations.
• Thermal & Process Engineering

• • Heat‑transfer and thermal‑storage studies, leveraging its high thermal stability and non‑flammability.
  • Solvent for high‑temperature extraction or purification processes where conventional solvents degrade.
• Separation Science

• • Liquid–liquid extraction of metal ions, aromatic hydrocarbons, and fluorinated species due to strong anion–solute interactions.
  • Gas absorption media, including CO₂ capture research, where PF₆⁻‑based ionic liquids provide tunable solubility and low volatility.
• Materials Science & Polymer Systems

• • Template or structuring agent in nanoparticle synthesis and porous materials.
  • Plasticizer or ionic dopant in polymer membranes to enhance conductivity and mechanical flexibility.
  • Surface modification studies where ionic liquids improve wettability or charge transport.
• Tribology & Surface Engineering

• • Lubricant additive for high‑temperature or vacuum environments, benefiting from its non‑volatile, thermally stable nature.
  • Anti‑wear and friction‑reduction studies in metal–metal and metal–ceramic interfaces.

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