1-Hexylpyridinium chloride, >98%

Price range: $481.21 through $2,713.36

Product Code: IL-0131-HP

CAS NO: 6220-15-1

  • Chemical Formula: 
  • Synonyms: HexPy Cl, N-Hexylpyridinium chloride
  • Aromatic
Clear

SUM Formula: C11H18ClN

Molecular Weight: 199.73

Melting Point: 35 °C

Density: 1.014 g/cm³

Purity: >98%

Viscosity: 4322 cP (25°C)

  • SUM Formula: C11H18ClN
  • Molecular Weight: 199.73
  • Melting Point: 35 °C
  • Density: 1.014 g/cm³
  • Viscosity: 4322 cP (25°C)

1-Hexylpyridinium chloride, CAS: 6220-15-1

Key Applications:

Electrochemistry & Energy Systems

  • Supporting electrolyte for non‑aqueous electrochemical studies requiring wide electrochemical windows.
  • Medium for metal and alloy electrodeposition, improving film uniformity and reducing dendritic growth.
  • Conductive phase for redox systems, corrosion studies, and ionic‑liquid‑based capacitors.

Catalysis & Organic Synthesis

  • Reaction medium for transition‑metal‑catalyzed C–C and C–N bond‑forming reactions.
  • Enhances phase‑transfer catalysis, especially for hydrophobic substrates.
  • Suitable for microwave‑assisted synthesis due to high polarity and thermal stability.

Extraction, Separation & Solvent Systems

  • Solvent for liquid–liquid extraction of metal ions, aromatics, and hydrophobic organics.
  • Co‑solvent in biphasic systems requiring adjustable polarity.
  • Supports selective partitioning of biomolecules and specialty chemicals.

Materials Science & Surface Engineering

  • Additive in polymer blends and composites to tune conductivity, plasticity, and thermal behavior.
  • Templating agent for nanoparticle and mesoporous material synthesis.
  • Used in surface functionalization of inorganic substrates.

Analytical Chemistry

  • Mobile‑phase additive in chromatography to improve peak shape and separation of ionic or hydrophobic analytes.
  • Employed in sample‑prep workflows for extraction and pre‑concentration.

Interfacial & Surface‑Tension Applications

  • Acts as a surface‑active ionic liquid, reducing surface tension in aqueous and mixed‑solvent systems.
  • Used to stabilize foams, emulsions, and dispersions, especially where ionic strength and hydrophobic chain length influence interfacial behavior.
  • Improves wetting, spreading, and coating uniformity on metals, ceramics, and polymeric surfaces.
  • Supports studies of interfacial charge, micelle formation, and aggregation behavior in soft‑matter and colloidal systems.
  • Useful in microfluidic and droplet‑based platforms where controlled surface tension is required for droplet formation and stability.

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Additional information

Weight 25 g
Qty

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